Title:
ARC DEPOSITION DEVICE, ARC DEPOSITION METHOD AND SOLID EVAPORATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2016/114072
Kind Code:
A1
Abstract:
Provided are an arc deposition device and an arc deposition method capable of improving the degree of freedom at which a positive electrode side evaporation material may be set. An arc deposition device 100 is provided with a negative electrode side evaporation metal 1 that is disposed in a position facing the interior of a vacuum chamber 2, connected to a negative electrode 4b side of an arc power source 4 and that is evaporated by an arc discharge, and a solid positive electrode side evaporation metal 8 that is disposed in a position facing the interior of the vacuum chamber 2, connected to a positive electrode 4a side of the arc power source 4 and that is evaporated by electrons emitted from the negative electrode side evaporation metal 1. The positive electrode side evaporation metal 8 comprises a material having the property of sublimating when impinged upon by electrons and heated.
Inventors:
MIYAMOTO RYOJI
TAMAGAKI HIROSHI
TAMAGAKI HIROSHI
Application Number:
PCT/JP2015/085520
Publication Date:
July 21, 2016
Filing Date:
December 18, 2015
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
C23C14/24; C23C14/32
Foreign References:
| JPH0625835A | 1994-02-01 | |||
| JP2001058266A | 2001-03-06 | |||
| JPH1068070A | 1998-03-10 | |||
| JP2014070226A | 2014-04-21 | |||
| US20100213054A1 | 2010-08-26 | |||
| JPH04191360A | 1992-07-09 | |||
| JP2003082458A | 2003-03-19 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
Download PDF:
Previous Patent: HOUSING FOR HOUSEHOLD ELECTRICAL APPLIANCE
Next Patent: JOINING SYSTEM AND JOINING METHOD
Next Patent: JOINING SYSTEM AND JOINING METHOD