Title:
ARRAY SUBSTRATE AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/006831
Kind Code:
A1
Abstract:
Provided in the present invention is a method for fabricating an array substrate: forming a first photoresist pattern on a buffer layer of a non-display region, removing a buffer layer not covered by the first photoresist pattern so as to form first vias on the non-display region, and forming second vias on the foundation of the first vias, wherein the second vias and the first vias are connected. By means of forming first vias on a non-display region and forming second vias on the foundation of the first vias, the completeness of a film layer may be ensured, thus improving product yield.
Inventors:
CHEN CAIQIN (CN)
MING XING (CN)
MING XING (CN)
Application Number:
PCT/CN2018/101962
Publication Date:
January 09, 2020
Filing Date:
August 23, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L29/786; H01L21/336; H01L21/77; H01L27/12
Foreign References:
| CN103681659A | 2014-03-26 | |||
| CN104900532A | 2015-09-09 | |||
| US20060128045A1 | 2006-06-15 | |||
| US7381596B2 | 2008-06-03 |
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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