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Patent Searching and Data


Title:
ASSEMBLY, METHOD FOR MANUFACTURING ASSEMBLY, BURNER, AND METHOD FOR MANUFACTURING BURNER
Document Type and Number:
WIPO Patent Application WO/2023/171430
Kind Code:
A1
Abstract:
This assembly comprises a wall body in which is formed a through-hole passing through in a thickness direction, and a component fixed to one surface of the wall body so as to cover the through-hole, a welded part welded so as to fix the component to the one surface being accommodated within the through-hole.

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Inventors:
WATANABE MASAHIRO (JP)
KINOSHITA TAIKI (JP)
NAKAMURA SOSUKE (JP)
MOTOYAMA NORIHIKO (JP)
MAENO SHIRO (JP)
HASEGAWA MITSUO (JP)
TAKAHASHI YUSUKE (JP)
GOTOH KENICHI (JP)
SUIZU TAIJI (JP)
Application Number:
PCT/JP2023/006910
Publication Date:
September 14, 2023
Filing Date:
February 27, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
MITSUBISHI POWER LTD (JP)
International Classes:
F23D14/70; B23K9/00; B23K9/02; F23R3/06
Foreign References:
JPH0639539A1994-02-15
JP2016003785A2016-01-12
JPH08278029A1996-10-22
JP2017180899A2017-10-05
JP2005315473A2005-11-10
JP2013072316A2013-04-22
Attorney, Agent or Firm:
SSIP PATENT ATTORNEY CORPORATION (JP)
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