ASSEMBLY STRUCTURE FOR INJECTION MOLDED SUBSTRATE AND FOR MOUNTING COMPONENT

Title:

ASSEMBLY STRUCTURE FOR INJECTION MOLDED SUBSTRATE AND FOR MOUNTING COMPONENT

Document Type and Number:

WIPO Patent Application WO/2011/078214

Kind Code:

A1

Abstract:

A substrate (1) is configured from a conductive portion (7) formed by means of press processing, and a resin portion (11) which is integrally formed with the conductive portion (7) by means of injection molding. The conductive portion (7) is formed, for example, from copper alloy. The resin portion (11) is formed, for example, from PPS. A mounting component (3), which is an electronic mounting component, is mounted on the substrate (1). Electrodes (5) are formed on both sides of the mounting component (3), and the electrodes (5) and conductive portion (7) are electrically connected by means of a solder (9). A hole (13), which functions as a stress alleviation mechanism, is formed on the resin portion (11) (protruding portion) of the substrate (1) and below the mounting component (3) between the connecting portions (15). Moreover, resin exposed sections (13), which function as a stress alleviation mechanism, are formed on both sides of the mounting component (3).

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Inventors:

TORATANI TOMOAKI (JP)
HARA TOSHITAKA (JP)
ABE KYUTARO (JP)
SHIBAMURA MOTOMU (JP)
HASHIMOTO KYOSUKE (JP)

Application Number:

PCT/JP2010/073112

Publication Date:

June 30, 2011

Filing Date:

December 22, 2010

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA AUTOMOTIVE SYS INC (JP)
TORATANI TOMOAKI (JP)
HARA TOSHITAKA (JP)
ABE KYUTARO (JP)
SHIBAMURA MOTOMU (JP)
HASHIMOTO KYOSUKE (JP)

International Classes:

H05K1/02; H05K1/18; H05K3/34

Foreign References:

JP2004311898A	2004-11-04
JPH06302933A	1994-10-28
JP2001210954A	2001-08-03
JP2008108881A	2008-05-08
JP2005051204A	2005-02-24
JP2002184909A	2002-06-28
JP2004228364A	2004-08-12
JP2002374058A	2002-12-26
JP2004311898A	2004-11-04

Other References: