ATOMIC LAYER DEPOSITION CHAMBER WITH MULTI INJECT

Title:

ATOMIC LAYER DEPOSITION CHAMBER WITH MULTI INJECT

Document Type and Number:

WIPO Patent Application WO/2011/112617

Kind Code:

A3

Abstract:

Embodiments of the invention relate to apparatus and methods for depositing materials on substrates during atomic layer deposition processes. In one embodiment, a chamber lid assembly comprises a channel having an upper portion and a lower portion, wherein the channel extends along a central axis, a housing having an inner region and at least partially defining two or more annular channels, an insert disposed in the inner region and defining the upper portion, the upper portion fluidly coupled with the two or more annular channels, and a tapered bottom surface extending from the bottom portion of the channel to a peripheral portion of the chamber lid assembly.

Inventors:

YUDOVSKY JOSEPH (US)
NGUYEN ANH N (US)
NGO TAI T (US)

Application Number:

PCT/US2011/027599

Publication Date:

November 24, 2011

Filing Date:

March 08, 2011

Export Citation:

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Assignee:

APPLIED MATERIALS INC (US)
YUDOVSKY JOSEPH (US)
NGUYEN ANH N (US)
NGO TAI T (US)

International Classes:

C23C16/455; C23C16/44; H01L21/205

Foreign References:

KR20040042892A	2004-05-20
KR20090083404A	2009-08-03
US20050252449A1	2005-11-17
US20080268171A1	2008-10-30
KR20070015959A	2007-02-06

Other References: