Title:
Au-Sn ALLOY SOLDER PASTE, METHOD FOR MANUFACTURING Au-Sn ALLOY SOLDER LAYER, AND Au-Sn ALLOY SOLDER LAYER
Document Type and Number:
WIPO Patent Application WO/2016/076353
Kind Code:
A1
Abstract:
This Au-Sn alloy solder paste includes an Au-Sn alloy powder that includes Sn at a level within a range of 61-70 mass%, with the remainder being Au and unavoidable impurities, and a flux. The oxygen concentration in the Au-Sn alloy powder is within the range of 50-1,800 mass ppm.
Inventors:
ISHIKAWA MASAYUKI (JP)
YAMAMOTO YOSHIFUMI (JP)
YAMAMOTO YOSHIFUMI (JP)
Application Number:
PCT/JP2015/081728
Publication Date:
May 19, 2016
Filing Date:
November 11, 2015
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| JP2004031697A | 2004-01-29 | |||
| JP2008010545A | 2008-01-17 | |||
| JP2011167761A | 2011-09-01 | |||
| JP2008080393A | 2008-04-10 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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