AUTOMATIC ADHESION DEVICE AND BACK PLATE CUTTING SYSTEM

WIPO Patent Application WO/2020/001435

A1

Provided are an automatic adhesion device and a back plate cutting system comprising the automatic adhesion device. The automatic adhesion device comprises: an adhesion mechanism for adhering an adhesion material layer (3) onto a first surface of an object that is to undergo adhesion (2) and that is provided with a through-hole (1), the adhesion material layer (3) at least partially covering the through-hole (1) and a surrounding surface thereof; a covering mechanism for cutting the adhesion material layer (3) on the through-hole (1) and folding two sections of the adhesion material layer (3) that are formed after being cut so as to respectively cover opposing sidewalls of the through-hole (1). The automatic adhesion device and the back plate cutting system eliminate the requirement to manually adhere an insulating tape in a through-hole of a flexible back plate in the prior art by automatically adhering an insulating tape in a through-hole of a flexible back plate, thereby eliminating a bottleneck in the implementation of automation for an entire production line, realizing a higher level of automation in a production line for photovoltaic assemblies, and as a result increasing economic efficiency and reducing labor costs.

LIAO ANWEN (CN)
MA WENJUN (CN)
ZHANG YINKU (CN)
PAN ERFENG (CN)
XU RIHUI (CN)
XU JIANPING (CN)
MAO MINGJUN (CN)
YU XI (CN)

PCT/CN2019/092798

January 02, 2020

June 25, 2019

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LINGFAN RENEWABLE ENERGY TECH BEIJING CO LTD (CN)

H01L31/18; B65H35/07

CN205845993U	2016-12-28
CN102956755A	2013-03-06
CN206271735U	2017-06-20
CN204057417U	2014-12-31
CN107507889A	2017-12-22
US20120073629A1	2012-03-29

BEIJING ZHICHEN INTELLECTUAL PROPERTY AGENCY LTD. (CN)

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