Title:
AUTOMATIC DIE-CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/104788
Kind Code:
A1
Abstract:
An automatic die-cutting device, comprising a feeding mechanism (600) used for feeding a printed material (88), a rewinding mechanism (603) used for rewinding the printed material, an automatic die-cutting mechanism (601) used for performing a die-cutting operation on the printed material, and a first floating roller mechanism (604) used for adjusting the tension of the printed material. The first floating roller mechanism is provided between the feeding mechanism and the automatic die-cutting mechanism. The die-cutting device can achieve automatic die-cutting, adjust the tension of the printed material, and avoid the problem that a fitting degree of the printed material and a roller is poor due to the fact that the tension of the printed material is too small.
Inventors:
LI XIN (CN)
HOU FEI (CN)
HOU FEI (CN)
Application Number:
PCT/CN2020/130859
Publication Date:
May 27, 2022
Filing Date:
November 23, 2020
Export Citation:
Assignee:
SHENZHEN BOTAI DIGITAL INTELLIGENT TECH CO LTD (CN)
International Classes:
B26D7/06; B26F1/38; B26D7/14; B26D7/32
Foreign References:
| CN112405702A | 2021-02-26 | |||
| CN213859652U | 2021-08-03 | |||
| CN111572212A | 2020-08-25 | |||
| CN209440297U | 2019-09-27 | |||
| CN103407824A | 2013-11-27 | |||
| CN109129613A | 2019-01-04 | |||
| CN205521713U | 2016-08-31 | |||
| CN208946348U | 2019-06-07 | |||
| CN202910933U | 2013-05-01 | |||
| US20140202295A1 | 2014-07-24 |
Attorney, Agent or Firm:
SZ KINDWALF INTELLECTUAL PROPERTY FIRM (CN)
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