AUTOMATIC WIRE BONDER - MITSUBISHI ELECTRIC CORP

Title:

AUTOMATIC WIRE BONDER

Document Type and Number:

WIPO Patent Application WO/2012/108250

Kind Code:

A1

Abstract:

An automatic wire bonder whereby it becomes possible to prevent the breakage of an electrode wire and to achieve an annealing treatment of a fine electrode wire having a diameter (φ) of 0.1 mm or less which is particularly likely to be broken. This automatic wire bonder comprises: a heating electrode (5) which is electrically connected to an electrode wire to heat the electrode wire; a tension-applying section (2) which applies a tension to the electrode wire to which an electric current has been supplied by means of the heating electrode; a tension control section which controls the tension to be applied by means of the tension-applying section; and a power control section (6) which supplies an electric current for heating purposes that is lower than a predetermined electric current for annealing purposes to the electrode wire during the period from the time point of the initiation of the supply of the electric current to the time point when a first set period elapses after the initiation of the supply of the electric current, and which increases the electric current to be supplied to the electrode wire to a level that is equal to the electric current for annealing purposes during a second set period that follows the elapse of the first set period after the initiation of the supply of the electric current.

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Inventors:

LIU ZHENGYONG (JP)
NAGAOKA RINTARO (JP)

Application Number:

PCT/JP2012/051258

Publication Date:

August 16, 2012

Filing Date:

January 20, 2012

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)
LIU ZHENGYONG (JP)
NAGAOKA RINTARO (JP)

International Classes:

B23H7/10

Foreign References:

JP2003285227A	2003-10-07
JPS491417A	1974-01-08
JP2003094253A	2003-04-03
JPH1017942A	1998-01-20
JPH09137233A	1997-05-27
JP2006007400A	2006-01-12

Attorney, Agent or Firm:

SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)

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