Title:
AUXILIARY STRUCTURE FOR CHIP PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/055767
Kind Code:
A1
Abstract:
An auxiliary structure (30) for a chip package, applied to combined mounting with a metal top cover of a chip package. The metal top cover (10) comprises a plurality of top cover side recesses (101), top cover side protrusions (102) and top cover four-corner protrusions (103). The auxiliary structure (30) comprises a plurality of auxiliary structure side protrusions (301), auxiliary structure side recesses (302, 402, 502) and auxiliary structure four-corner recesses (303, 403, 503) matched with the plurality of top cover side recesses (101), top cover side protrusions (102) and top cover four-corner protrusions (103) in position and shape in a top view direction. The auxiliary structure (30) for a chip package not only can assist the core heat dissipation of the metal top cover (10) of a CPU, but also can protect electronic components exposed by the recesses (101) of the metal top cover (10).
Inventors:
LI YAN (CN)
GU XIAODONG (CN)
GU XIAODONG (CN)
Application Number:
PCT/CN2023/110655
Publication Date:
March 21, 2024
Filing Date:
August 02, 2023
Export Citation:
Assignee:
BEI JING DEEPCOOL SCI TECH CO LTD (CN)
International Classes:
H01L23/04; H01L23/10
Foreign References:
| CN217983318U | 2022-12-06 | |||
| CN101197384A | 2008-06-11 | |||
| CN2636414Y | 2004-08-25 | |||
| CN101192543A | 2008-06-04 | |||
| CN109588023A | 2019-04-05 | |||
| CN109856738A | 2019-06-07 | |||
| CN113816332A | 2021-12-21 | |||
| CN214753738U | 2021-11-16 | |||
| CN215933571U | 2022-03-01 | |||
| US20050280140A1 | 2005-12-22 |
Attorney, Agent or Firm:
BEIJING XINGZHIXIANGDA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF:
Previous Patent: STIRRING TYPE WET BALL MILLING APPARATUS
Next Patent: DISPLAY PANEL, DISPLAY PANEL MANUFACTURING METHOD, AND DISPLAY DEVICE
Next Patent: DISPLAY PANEL, DISPLAY PANEL MANUFACTURING METHOD, AND DISPLAY DEVICE