Title:
BACK-SURFACE-PROTECTION-FILM FORMING COMPOSITE, METHOD FOR MANUFACTURING FIRST LAMINATED BODY, METHOD FOR MANUFACTURING THIRD LAMINATED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE EQUIPPED WITH BACK SURFACE PROTECTION FILM
Document Type and Number:
WIPO Patent Application WO/2021/166991
Kind Code:
A1
Abstract:
A back-surface-protection-film forming composite (1) that is formed by laminating a back-surface-protection-film forming film (13) on a protection layer (12) is used for a method for manufacturing a first laminated body, said method including: a first lamination step for bonding the back-surface-protection-film forming film (13) to a back surface of a semiconductor substrate to obtain a second laminated body in which the semiconductor substrate, the back-surface-protection-film forming film (13), and the protection layer (12) are laminated in that order; a curing step for curing the back-surface-protection-film forming film (13) of the second laminated body to obtain a back surface protection film; and a transportation step for transporting the second laminated body from the first lamination step to the curing step, whereby the first laminated body includes the semiconductor substrate, the back surface protection film, and the protection layer (12) that are laminated in that order.
Inventors:
NAKAISHI YASUNOBU (JP)
Application Number:
PCT/JP2021/006067
Publication Date:
August 26, 2021
Filing Date:
February 18, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B37/02; B32B37/12; B32B37/16; H01L21/301; H01L21/683
Domestic Patent References:
| WO2017047183A1 | 2017-03-23 |
Foreign References:
| JP2009130233A | 2009-06-11 | |||
| JP2014192462A | 2014-10-06 | |||
| JP2015032644A | 2015-02-16 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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