BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES

Title:

BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES

Document Type and Number:

WIPO Patent Application WO/2010/065835

Kind Code:

A3

Abstract:

There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon. There are spaces around the electrode structures and a layer of organic filler in the spaces. The thickness of the layer of organic filler is the same as the thickness of the electrode structures.

Inventors:

STAINER MATTHEW (US)
TSAI YAW-MING A (US)

Application Number:

PCT/US2009/066742

Publication Date:

September 16, 2010

Filing Date:

December 04, 2009

Export Citation:

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Assignee:

DU PONT (US)
STAINER MATTHEW (US)
TSAI YAW-MING A (US)

International Classes:

H01L51/50; H01L29/786

Foreign References:

KR100669740B1	2007-01-16
KR100637187B1	2006-10-23
KR100603335B1	2006-07-20
KR20070109162A	2007-11-15

Attorney, Agent or Firm:

LAMMING, John, H. (Legal Patent Records Center4417 Lancaster Pik, Wilmington Delaware, US)

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