Title:
BALL CAPTURING DEVICE, SOLDER BALL ARRANGEMENT DEVICE, BALL CAPTURING METHOD, AND SOLDER BALL ARRANGING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/103766
Kind Code:
A1
Abstract:
A ball capturing device and a ball capturing method for capturing one ball from a plurality of balls of the same size and a solder ball arranging device and a solder ball arranging method for arranging solder balls with solder at prescribed positions on a circuit board, wherein one ball is securely captured from the plurality of balls of the same size. The ball capturing device comprises a storage body (111) in which a small hole (1111) larger in size than one ball (B) and smaller in size than two balls is formed in the upper part of a storage wall (111a) enclosing a space (S) storing the plurality of balls (B) of the same size, a blow-up means (112) blowing up the balls B stored in the storage body (111), and a capturing means (12) capturing the balls (B) blown up by the blow-up means (112) and reaching the hole (1111).
Inventors:
FUJII MASANAO (JP)
OKADA TORU (JP)
NODA YUTAKA (JP)
MATSUYAMA RYOJI (JP)
KOBAYASHI HIDEHIKO (JP)
TANAKA HISAO (JP)
OKADA TORU (JP)
NODA YUTAKA (JP)
MATSUYAMA RYOJI (JP)
KOBAYASHI HIDEHIKO (JP)
TANAKA HISAO (JP)
Application Number:
PCT/JP2005/006099
Publication Date:
October 05, 2006
Filing Date:
March 30, 2005
Export Citation:
Assignee:
FUJITSU LTD (JP)
FUJII MASANAO (JP)
OKADA TORU (JP)
NODA YUTAKA (JP)
MATSUYAMA RYOJI (JP)
KOBAYASHI HIDEHIKO (JP)
TANAKA HISAO (JP)
FUJII MASANAO (JP)
OKADA TORU (JP)
NODA YUTAKA (JP)
MATSUYAMA RYOJI (JP)
KOBAYASHI HIDEHIKO (JP)
TANAKA HISAO (JP)
International Classes:
B23K3/06; H05K3/34; H01L21/60
Foreign References:
| JPH09298356A | 1997-11-18 | |||
| JPH11284003A | 1999-10-15 | |||
| JP2004023028A | 2004-01-22 | |||
| JP2001068840A | 2001-03-16 |
Attorney, Agent or Firm:
Yamada, Masaki (4th Floor 3-3, Nishi-shimbashi 3-chom, Minato-ku Tokyo 03, JP)
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