BALL MOUNTING METHOD AND SUBSTRATE-WORKING MACHINE

Title:

BALL MOUNTING METHOD AND SUBSTRATE-WORKING MACHINE

Document Type and Number:

WIPO Patent Application WO/2013/153616

Kind Code:

A1

Abstract:

Provided is a substrate-working machine, comprising a work device that selectively executes the work of mounting a conductive ball onto a circuit substrate using a ball holder (82) and the work of transferring an viscous fluid onto the circuit substrate using a transfer pin, and a tray in which the viscous fluid is stored, wherein, when the conductive ball is mounted onto the circuit substrate, the viscous fluid is transferred onto the circuit substrate using the transfer pin and then the conductive ball, immersed in the viscous fluid, is mounted on top of the transferred viscous fluid. This configuration enables the conductive ball to be secured onto the circuit substrate by using the viscous fluid transferred to the circuit substrate using the transfer pin and by using the viscous fluid adhered to the conductive ball due to the conductive ball being immersed in the adhesive fluid, and enables the conductive ball to be appropriately mounted onto the circuit substrate using a large quantity of the viscous fluid.

Inventors:

OKA HIROMITSU (JP)
HAYASHI TETSUO (JP)

Application Number:

PCT/JP2012/059769

Publication Date:

October 17, 2013

Filing Date:

April 10, 2012

Export Citation:

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Assignee:

FUJI MACHINE MFG (JP)
OKA HIROMITSU (JP)
HAYASHI TETSUO (JP)

International Classes:

B23K3/06; H05K3/34; H01L21/60

Foreign References:

JPH08340174A	1996-12-24
JPH09260836A	1997-10-03
JP2007287888A	2007-11-01
JP2001284787A	2001-10-12
JPH09246704A	1997-09-19
JP2011091192A	2011-05-06
JP2012043904A	2012-03-01

Other References: