Title:
BALLOON MOUNTING PLATE
Document Type and Number:
WIPO Patent Application WO/2007/138721
Kind Code:
A1
Abstract:
A device to which balloons are easily mounted and removed to facilitate installation and
removal of the balloons at an event site, on which the balloons prepared for distribution
can be orderly arranged, and that does not produce refuse at the event site. In
the balloon mounting plate, a large number of cutout sections (3) and a large number
of insertion sections (2) are formed in a resin foam plate (1) of an appropriate
thickness. To attach a balloon to the plate, a locking piece of the balloon is
passed to the rear side of the balloon mounting plate through a cutout section
(3) and held by an insertion section (2).
Inventors:
IWASA YOKO (JP)
Application Number:
PCT/JP2006/319899
Publication Date:
December 06, 2007
Filing Date:
September 19, 2006
Export Citation:
Assignee:
IWASA YOKO (JP)
International Classes:
A47F7/00; A63H27/10
Foreign References:
| JPS57148978A | 1982-09-14 | |||
| JPS57172574U | 1982-10-30 |
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