Title:
BALUN STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/137685
Kind Code:
A1
Abstract:
Embodiments of the present disclosure provide a balun structure and an electronic device. The balun structure comprises a dielectric substrate, a first grounding conductive layer, a first transmission line, a second transmission line, and a third transmission line; at least one coupling structure is connected in series between a first end and a second end of the third transmission line; the coupling structure comprises a first coupling portion and a second coupling portion; in the same coupling structure, the end of the first coupling portion facing the second coupling portion is provided with at least one first bifurcation line, and the end of the second coupling portion facing the first coupling portion is provided with at least one second bifurcation line; in the same coupling structure, the end of the first bifurcation line close to the second coupling portion is electrically connected to the first grounding conductive layer by means of a first through hole, and the end of the second bifurcation line close to the first coupling portion is electrically connected to the first grounding conductive layer by means of a second through hole; and in the same coupling structure, the first bifurcation line of the first coupling portion is coupled to the second bifurcation line of the second coupling portion.
Inventors:
GUO HAO (CN)
JIA HAOCHENG (CN)
LU YAN (CN)
DING YI (CN)
MA WENXUE (CN)
ZHOU WEISI (CN)
WANG JING (CN)
WANG XIAOBO (CN)
CHE CHUNCHENG (CN)
JIA HAOCHENG (CN)
LU YAN (CN)
DING YI (CN)
MA WENXUE (CN)
ZHOU WEISI (CN)
WANG JING (CN)
WANG XIAOBO (CN)
CHE CHUNCHENG (CN)
Application Number:
PCT/CN2022/073100
Publication Date:
July 27, 2023
Filing Date:
January 21, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE SENSOR TECH CO LTD (CN)
BEIJING BOE SENSOR TECH CO LTD (CN)
International Classes:
H01P5/10
Foreign References:
| US20080252393A1 | 2008-10-16 | |||
| US20030001710A1 | 2003-01-02 | |||
| US20140240056A1 | 2014-08-28 | |||
| US20040135647A1 | 2004-07-15 | |||
| CN113764851A | 2021-12-07 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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