Title:
BASE BOARD SEALING STRUCTURE BODY, AND, DISPLAY DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/064372
Kind Code:
A1
Abstract:
In the present embodiment, a sealant (50) sealing two base boards contains a low melting-point glass material and is adhered to each of a first base board (10) and a second base board (20), a separation wall (60), which is formed in such a manner as to surround the outer periphery of an electronic element (30), is disposed between the sealant (50) and the electronic element (30), and between the first base board (10) and the second base board (20), and the sealant (50) is spaced apart from the separation wall (60). As a result, a deterioration of the electronic element, caused by the heat produced when sealing, may be prevented while the electronic element formed between the two base boards is protected from moisture and oxygen.
Inventors:
KOBAYASHI YUHKI (JP)
KAWATO SHINICHI (JP)
MINOURA KIYOSHI (JP)
SHIMADA SHINJI (JP)
TSUCHIYA HIROSHI (JP)
MITANI MASAHIRO (JP)
NAKAMURA KOHZOH (JP)
KISHIMOTO KATSUHIKO (JP)
NARUTAKI YOZO (JP)
KAWATO SHINICHI (JP)
MINOURA KIYOSHI (JP)
SHIMADA SHINJI (JP)
TSUCHIYA HIROSHI (JP)
MITANI MASAHIRO (JP)
NAKAMURA KOHZOH (JP)
KISHIMOTO KATSUHIKO (JP)
NARUTAKI YOZO (JP)
Application Number:
PCT/JP2017/034935
Publication Date:
April 04, 2019
Filing Date:
September 27, 2017
Export Citation:
Assignee:
SHARP KK (JP)
SAKAI DISPLAY PRODUCTS CORP (JP)
SAKAI DISPLAY PRODUCTS CORP (JP)
International Classes:
H05B33/04; G02F1/1339; G02F1/1362; G09F9/00; G09F9/46; H01L27/32; H01L51/50; H05B33/02; H05B33/12
Foreign References:
| JP2017120867A | 2017-07-06 | |||
| JP2013125718A | 2013-06-24 | |||
| JP2008218393A | 2008-09-18 | |||
| JP2010108905A | 2010-05-13 | |||
| JP2014063153A | 2014-04-10 | |||
| JP2017062474A | 2017-03-30 | |||
| JP2008225381A | 2008-09-25 | |||
| US20120299816A1 | 2012-11-29 |
Attorney, Agent or Firm:
ASAHINA & CO. (JP)
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