Title:
BASE FILM FOR DICING SHEET, AND DICING SHEET
Document Type and Number:
WIPO Patent Application WO/2011/122428
Kind Code:
A1
Abstract:
Disclosed is a base film (2) for a dicing sheet, which is used for a dicing sheet (1) that comprises the base film (2) and an adhesive layer (3) that is arranged on one surface of the base film (2). The base film (2) for a dicing sheet is composed of one or a plurality of resin films, and at least a resin film that is in contact with the adhesive layer (3) is obtained by molding a resin composition, which is mainly composed of an ethylene-methacrylate copolymer and contains 0.3-17.0 parts by mass of an epoxy compound per 100 parts by mass of the ethylene-methacrylate copolymer. The dicing sheet (1) that uses the base film (2) for a dicing sheet does not require application of physical energy such as an electron beam or a γ-ray, and can be reduced in dicing dust that is generated during the dicing of an object to be cut. In addition, the dicing sheet (1) that uses the base film (2) for a dicing sheet has excellent expandability.
Inventors:
TAYA NAOKI (JP)
MORIOKA TAKASHI (JP)
MORIOKA TAKASHI (JP)
Application Number:
PCT/JP2011/057116
Publication Date:
October 06, 2011
Filing Date:
March 24, 2011
Export Citation:
Assignee:
LINTEC CORP (JP)
TAYA NAOKI (JP)
MORIOKA TAKASHI (JP)
TAYA NAOKI (JP)
MORIOKA TAKASHI (JP)
International Classes:
H01L21/301; C09J7/29
Foreign References:
| JP2005033059A | 2005-02-03 | |||
| JP2007088240A | 2007-04-05 | |||
| JP2009206310A | 2009-09-10 | |||
| JP2002235061A | 2002-08-23 |
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)
Yuji Hayakawa (JP)
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Claims:
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