Title:
BASE FILM FOR VAPOR DEPOSITION, AND VAPOR DEPOSITION FILM
Document Type and Number:
WIPO Patent Application WO/2024/019169
Kind Code:
A1
Abstract:
Provided are: a base film which has high heat resistance, flexibility, and dimensional stability and is used for providing a vapor deposition layer on at least one surface thereof; and a vapor deposition film comprising said base film and a vapor deposition layer. A base film for vapor deposition is composed of a methacrylic resin composition (I) which contains a methacrylic copolymer (a) having 5-73 mass% of methyl methacrylate units, 25-70 mass% of structural units (r) represented by formula (1), 1-48 mass% of α-methylstyrene units, 1-48 mass% of at least one selected from the group consisting of styrene units and maleic anhydride units, and 0-20 mass% of unsubstituted or N-substituted maleimide units, and which has a glass transition temperature of 135 °C or higher, wherein the film thickness is 10-80 μm, and a biaxial stretch ratio is a multiple of 1.5-8. (In formula (I), R1 and R2 are the same as described in the specification.)
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Inventors:
NOMOTO YUSAKU (JP)
NAKAMURA KIMITOSHI (JP)
NAKAMURA KIMITOSHI (JP)
Application Number:
PCT/JP2023/026859
Publication Date:
January 25, 2024
Filing Date:
July 21, 2023
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08J5/18; B29C55/12; C08F8/30; C08F8/48; C08F212/12; C08F220/14; C23C14/20
Domestic Patent References:
| WO2021235393A1 | 2021-11-25 | |||
| WO2021193922A1 | 2021-09-30 | |||
| WO2020100913A1 | 2020-05-22 | |||
| WO2022202965A1 | 2022-09-29 |
Foreign References:
| JPH06256537A | 1994-09-13 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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