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Patent Searching and Data


Title:
BASE MATERIAL FOR HONEYCOMB, HONEYCOMB STRUCTURE, AND SANDWICH STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/031479
Kind Code:
A1
Abstract:
 The present invention provides a honeycomb structure that is lightweight, has high strength and rigidity, and exhibits exceptional properties in terms of water resistance and moldability. This honeycomb structure comprises a thermoplastic resin composition that contains a polyamide (A) and a modified polyolefin (B), wherein the honeycomb structure is characterized in that: the polyamide (A) contains diamine units of which 70 mol% or more are xylylenediamine units, and dicarboxylic acid units of which 50 mol% or more are C4-20 α,ω-linear aliphatic dicarboxylic acid units; the modified polyolefin (B) is a polyolefin having reactive functional groups selected from epoxy groups and the like; and the mixture ratio of polyamide (A)/ modified polyolefin (B) is within the range of 100/15-70 on the basis of mass.

Inventors:
MATSUMOTO NOBUHIKO (JP)
Application Number:
PCT/JP2015/071564
Publication Date:
March 03, 2016
Filing Date:
July 29, 2015
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B3/12; C08L23/26; C08L77/06; E04F13/08
Foreign References:
JP2013237242A2013-11-28
JP2010168040A2010-08-05
JP2008520456A2008-06-19
Other References:
See also references of EP 3187330A4
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Kobayashi 浩 (JP)
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