Title:
BASE MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/077816
Kind Code:
A1
Abstract:
This base material for a printed wiring board is provided with: an insulating base film; a sintered layer which is stacked on the surface of at least one side of the base film, and which is formed from a plurality of sintered metal particles; an electroless plating layer which is stacked on the surface of the sintered layer on the opposite side to the base film; and an electroplating layer which is stacked on the surface of the electroless plating layer on the opposite side to the sintered layer. The arithmetic average height Sa of the surface of the electroless plating layer on the opposite side to the sintered layer is in the range of 0.001-0.5 µm inclusive.
Inventors:
MIYATA KAZUHIRO (JP)
KASUGA TAKASHI (JP)
OKA YOSHIO (JP)
UEDA HIROSHI (JP)
KASUGA TAKASHI (JP)
OKA YOSHIO (JP)
UEDA HIROSHI (JP)
Application Number:
PCT/JP2018/025838
Publication Date:
April 25, 2019
Filing Date:
July 09, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/24; B22F1/0545; C22C1/04; C23C28/02; H05K1/09; H05K3/00
Foreign References:
| JP2016225524A | 2016-12-28 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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