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Title:
BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2013/172295
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel base resin for a soldering flux, said novel base resin being capable of improving the fluidity of a flux, the viscosity stability and tackiness of a solder paste, and the color tone and crack resistance of a flux residue. This novel base resin comprises a rosin (A) containing: at least 15wt% of a pimarane-type resin acid (a-1); at least 1wt% of a labdane-type resin acid (a-2); and at least 50wt% of an abietane-type resin acid (a-3) that does not have any conjugated double bond.

Inventors:
FUNAKOSHI YASUSHI (JP)
NAKATANI TAKASHI (JP)
YOSHIMOTO TETSUYA (JP)
Application Number:
PCT/JP2013/063274
Publication Date:
November 21, 2013
Filing Date:
May 13, 2013
Export Citation:
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Assignee:
ARAKAWA CHEM IND (JP)
International Classes:
C08L93/04; B23K35/363; B23K35/26
Domestic Patent References:
WO2011145187A12011-11-24
WO2010098240A12010-09-02
Foreign References:
JP2007111735A2007-05-10
JP2012086269A2012-05-10
JP2002096194A2002-04-02
JP2002096193A2002-04-02
JP2011173173A2011-09-08
JP2008062239A2008-03-21
JPH06246482A1994-09-06
JP2008062239A2008-03-21
JP2011173173A2011-09-08
JPS51131899A1976-11-16
JPS51149256A1976-12-22
Other References:
J. AM. CHEM. SOC., vol. 70, 1948, pages 2079
J. ORG. CHEM., vol. 23, 1958, pages 25 - 26
CAN. J. CHEM., vol. 38, 1960, pages 663 - 667
J. AM. CHEM. SOC., vol. 77, 1955, pages 2823
WEISSMAN, HOLZFORSHUN, vol. 28, 1974, pages 186 - 188
J. ORG. CHEM., vol. 31, 1966, pages 4246 - 4248
J. ORG. CHEM., vol. 31, 1966, pages 4128
J. ORG. CHEM., vol. 34, 1969, pages 1550
See also references of EP 2851396A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
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