Title:
BEAD CORE FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/042616
Kind Code:
A1
Abstract:
In the present invention, a bead core formation device is provided with the following: a rubber covering device that covers the outer peripheral surface of a steel wire with rubber; and two cooling rollers (71, 80) on which rubber-covered lines (110), which are steel lines (110) covered in rubber, are wound. The second cooling roller (80) is provided with a first groove (82A), and a second groove (82B) on which a portion of the rubber-covered line (110) downstream from the first groove (82A) is wound. A diameter LB in a portion where the second groove (82B) is formed is smaller than a diameter LC in a portion where the first groove (82A) is formed.
Inventors:
SHIBUYA HIDETOSHI (JP)
Application Number:
PCT/JP2014/074527
Publication Date:
March 24, 2016
Filing Date:
September 17, 2014
Export Citation:
Assignee:
FUJI SEIKO CO LTD (JP)
FUJI SHOJI CO LTD (JP)
FUJI SHOJI CO LTD (JP)
International Classes:
B21F37/00; B29D30/48
Foreign References:
| JPH03148308A | 1991-06-25 | |||
| JP2002538997A | 2002-11-19 | |||
| JP2011207156A | 2011-10-20 |
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
Makoto Onda (JP)
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