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Patent Searching and Data


Title:
BEAD WIRE HAVING SUPERIOR ADHESION AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/182125
Kind Code:
A1
Abstract:
The present invention relates to a bead wire which is used for reinforcement of vehicle tires, and a method for producing the same. According to the present invention, through a process by which fine unevenness may be formed on the surface of a wire using electrolytic acid-treatment which allows a drawn wire to pass through an electrolytic bath in which an acid solution is received, and through a chemical displacement plating process by which a plating bath, which contains only one or a compound of two among cobalt, nickel, and manganese, passes through a copper-tin plating solution, a bead wire having superior adhesion is produced, wherein the bead wire has a plating layer formed thereon, the playing layer having a surface roughness of 0.01 to 1.50 µm and comprising: 97 to 99.99 % by weight of copper-tin (Cu-Sn), which consists of 75 to 99.99 % by weight of copper and 0.01 to 25 % by weight of tin; and 0.01 to 3.0% by weight of one or two components from among cobalt (Co), nickel (Ni) and manganese (Mn).

Inventors:
PARK OK SHIL (KR)
KIM DONG GIL (KR)
LIM SUNG JUN (KR)
Application Number:
PCT/KR2015/007843
Publication Date:
November 17, 2016
Filing Date:
July 28, 2015
Export Citation:
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Assignee:
HONGDUK IND CO LTD (KR)
International Classes:
B60C15/04; C23C18/18; C23C18/38; C23C18/48
Foreign References:
KR20120063080A2012-06-15
KR20130101581A2013-09-13
KR20010109630A2001-12-12
KR960011682B11996-08-29
KR20130049552A2013-05-14
KR20010112804A2001-12-22
Attorney, Agent or Firm:
KIM, YOUNG HWAN (KR)
김영환 (KR)
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