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Patent Searching and Data


Title:
BENDING SYSTEM AND BENDING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/014771
Kind Code:
A1
Abstract:
A working system is provided with a gripping unit for gripping a workpiece, and also with a bender for bending the workpiece using a die and a punch. The working system is also provided with: a detection unit for detecting, until the completion of predetermined working, the positional misalignment between the gripping unit and the workpiece; and a correction unit for correcting the positional misalignment by causing, on the basis of the result of the detection by the detection unit, the gripping unit to release and re-grip the workpiece. The working system can prevent a bending failure due to the positional misalignment of the workpiece before, in the middle of, and after bending.

Inventors:
ISHIBASHI NORIYASU (JP)
Application Number:
PCT/JP2011/066545
Publication Date:
February 02, 2012
Filing Date:
July 21, 2011
Export Citation:
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Assignee:
AMADA CO LTD (JP)
ISHIBASHI NORIYASU (JP)
International Classes:
B21D5/02
Foreign References:
JPH01289525A1989-11-21
JPS63126619A1988-05-30
JPH04505378A1992-09-17
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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Claims: