BENDING-TYPE RIGID PRINTED WIRING BOARD AND PROCESS FOR PRODUCING THE SAME

Title:

BENDING-TYPE RIGID PRINTED WIRING BOARD AND PROCESS FOR PRODUCING THE SAME

Document Type and Number:

WIPO Patent Application WO/2007/013595

Kind Code:

A1

Abstract:

This invention provides a bending-type rigid printed wiring board that can easily realize mounting of electric components (can realize a plated circuit having high productivity and assembling properties), can realize space saving, and can realize easy production. The bending-type rigid printed wiring board comprises a hard core material (1) with a space part (1A) inserted thereinto. A heat-resistant resin layer (31) is stacked on the surface of the hard core material (1) and, at the same time, on the upper surface of the space part (1A). A heat-resistant resin layer (32) is stacked on the backside of the core material (1) except for the space part (1A). Further, a conductor layer (4) is stacked and fixed through the heat-resistant resin layers (31, 32). The conductor layer (4) has been etched to form a circuit.

Inventors:

MOMOTA ATSUSHI (JP)
TERUNUMA ICHIRO (JP)
HASEGAWA TAKESHI (JP)
TAKEMURE YASUO (JP)
HATAKEYAMA YOSHIFUMI (JP)
HARADA HIROSHI (JP)
KATOH MAKOTO (JP)

Application Number:

PCT/JP2006/314995

Publication Date:

February 01, 2007

Filing Date:

July 28, 2006

Export Citation:

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Assignee:

FUJIKURA LTD (JP)
KYOEI ELECTRIC CO LTD (JP)
MOMOTA ATSUSHI (JP)
TERUNUMA ICHIRO (JP)
HASEGAWA TAKESHI (JP)
TAKEMURE YASUO (JP)
HATAKEYAMA YOSHIFUMI (JP)
HARADA HIROSHI (JP)
KATOH MAKOTO (JP)

International Classes:

H05K1/02; H05K3/00

Foreign References:

JPS61134246A	1986-06-21
JPS57195862U	1982-12-11
JPH09199816A	1997-07-31
JPS62185396A	1987-08-13
JP2004319962A	2004-11-11

Other References: