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Patent Searching and Data


Title:
BENDING WORK METHOD FOR PLATE MATERIAL AND DEVICE FOR ADJUSTING RESIDUAL STRESS
Document Type and Number:
WIPO Patent Application WO/2012/096362
Kind Code:
A1
Abstract:
A device for adjusting residual stress comprises: an input means for inputting information relating to cutting; a residual stress database associating a plurality of cutting conditions with the resulting residual stresses thereof; a processing condition database associating a plurality of processing conditions for adjusting residual stress with the resulting residual stresses thereof; a first searching means for, according to the information, searching for one residual stress (σ0) from the residual stress database; a calculation means for calculating a first bending moment (Mrs) produced at an edge line by the residual stress (σ0) and, from the information, a second bending moment (Mz) produced at the edge line by the bending to calculate a total bending moment (Mrs - Mz) and for calculating the curvature (ρz) of warpage produced in a workpiece by the total bending moment (Mrs - Mz); a comparison means for comparing the difference (|ρz - ρz0|) between the curvature (ρz) of warpage and a target value (ρz0) with an allowed value (ρ); a second searching means for, when the difference (|ρz - ρz0|) exceeds the allowed value (ρ), searching for one processing condition satisfying an allowed condition (|ρz - ρz0| ≤ ρ) from the processing condition database; and an adjusting means for adjusting, according to the searched processing condition, the residual stress of the workpiece in the range having a first width from a cutting edge and not including the bending line.

Inventors:
JIN YINGJUN (JP)
SHIBATA TAKAHIRO (JP)
KOYAMA JUNICHI (JP)
OMATA HITOSHI (JP)
Application Number:
PCT/JP2012/050543
Publication Date:
July 19, 2012
Filing Date:
January 13, 2012
Export Citation:
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Assignee:
AMADA CO LTD (JP)
JIN YINGJUN (JP)
SHIBATA TAKAHIRO (JP)
KOYAMA JUNICHI (JP)
OMATA HITOSHI (JP)
International Classes:
B21D5/01; B21D1/06; B21D5/02
Foreign References:
JP2004098078A2004-04-02
JPH07116733A1995-05-09
JPH0890075A1996-04-09
JPH0824954A1996-01-30
JPH02147120A1990-06-06
JPH03128125A1991-05-31
JP2005177790A2005-07-07
Other References:
See also references of EP 2664392A4
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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Claims: