Title:
BENT PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/082315
Kind Code:
A1
Abstract:
A bent printed circuit board (300), comprising: a flat portion (310) and a bent portion (320) connected to the flat portion (310), the flat portion comprising: a metal substrate (321), an isolation layer (322), a conductive layer (323) and a protection layer (324). The isolation layer (322) is disposed on a portion of a surface of the metal substrate (321), and the conductive layer (323) is disposed on the isolation layer (322), and the protection layer (324) is disposed on the conductive layer (323). A heat sink (330) is fixedly and directly connected to the metal substrate (321), so as to improve heat dissipation of the bent printed circuit board (300), as well as improve the reliability of the bent printed circuit board.
Inventors:
HE HU (CN)
Application Number:
PCT/CN2015/070305
Publication Date:
June 02, 2016
Filing Date:
January 07, 2015
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H05K1/02
Foreign References:
| US20070290328A1 | 2007-12-20 | |||
| CN101645274A | 2010-02-10 | |||
| US20080265271A1 | 2008-10-30 | |||
| CN103363397A | 2013-10-23 | |||
| CN103511930A | 2014-01-15 |
Attorney, Agent or Firm:
MING & YUE INTELLECTUAL PROPERTY LAW FIRM (CN)
深圳市铭粤知识产权代理有限公司 (CN)
深圳市铭粤知识产权代理有限公司 (CN)
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