Title:
BIAXIALLY ORIENTED POLYAMIDE-BASED RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2014/141870
Kind Code:
A1
Abstract:
Provided is a biaxially oriented polyamide-based resin film which exhibits excellent laminate strength, low-temperature pinhole resistance, impact resistance, and transparency, and which maintains an excellent external appearance even if subjected to sterilization treatment in hot water. This biaxially oriented polyamide-based resin film includes a polyamide-based resin, and a polyolefin-based elastomer and/or a polyamide-based elastomer, and satisfies conditions (1)-(5): (1) that the Gelbo pinhole defect number when a twist-flex test using a Gelbo flex tester has been performed 1000 times at a temperature of 1˚C be not more than 5; (2) that the impact strength be at least 0.9 J; (3) that the total transmission haze value be not more than 5.0%; (4) that the static friction coefficient at a temperature of 23˚C and a relative humidity of 50% be not more than 0.7; and (5) that the laminate strength of a stacked film obtained by laminating the biaxially oriented polyamide-based resin film and an unstretched polyethylene-based resin film be at least 5.0 N/15mm.
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Inventors:
MIYAGUCHI YOSHINORI (JP)
Application Number:
PCT/JP2014/054487
Publication Date:
September 18, 2014
Filing Date:
February 25, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08J5/18; B29C55/14; B32B27/34; B29K77/00; B29L7/00; B29L9/00
Domestic Patent References:
| WO2013084845A1 | 2013-06-13 | |||
| WO2013027476A1 | 2013-02-28 |
Foreign References:
| JP2006037070A | 2006-02-09 | |||
| JP2002166512A | 2002-06-11 | |||
| JP2010253713A | 2010-11-11 | |||
| JP2010234552A | 2010-10-21 | |||
| JP2004352796A | 2004-12-16 | |||
| JP2002179817A | 2002-06-26 | |||
| JPH11322974A | 1999-11-26 |
Other References:
See also references of EP 2975079A4
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