Title:
BIAXIALLY ORIENTED POLYAMIDE FILM FOR COLD MOLDING
Document Type and Number:
WIPO Patent Application WO/2024/084775
Kind Code:
A1
Abstract:
[Problem] To provide a biaxial polyamide film, which is suitable for cold molding and which is excellent in cold moldability, has excellently low hygroscopicity, and can be used for the outermost layer of a battery external material even in a single membrane form. [Solution] This biaxially oriented polyamide film for cold molding comprises 80-100 mass% of polyamide 11, wherein in a direction in which an F30/upper yield stress value, which is a value obtained by dividing stress (F30) with a 30% elongation by upper yield stress, is larger among the film flow direction and the film width direction, the F30/upper yield stress value is 2.0-3.0.
Inventors:
TAMARI NOBORU (JP)
NAGASAKA AYAME (JP)
GOTO TAKAMICHI (JP)
NAGASAKA AYAME (JP)
GOTO TAKAMICHI (JP)
Application Number:
PCT/JP2023/027978
Publication Date:
April 25, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
TOYOBO CO LTD (JP)
International Classes:
C08J5/18; B32B15/088; B32B15/20
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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