Title:
BIAXIALLY ORIENTED POLYAMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2023/176214
Kind Code:
A1
Abstract:
[Problem] To provide a polyamide film that not only has excellent cold formability regardless of position taken in the width direction of the film, but also has little dimensional accuracy deterioration due to springback after forming, and excels in warping resistance. [Solution] This biaxially oriented polyamide film includes 60 mass% or more of polyamide 6, and: (a) the piercing strength thereof measured in accordance with JIS Z 7102 is 0.5 to 1.0 N/μm; (b) the thermal shrinkage thereof at 160°C is 3.0% or less in both the MD direction and the TD direction; and (c) the stress damping factor thereof in a tensile stress relaxation test at 25°C is 12.0% or greater in both the MD direction and the TD direction.
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Inventors:
GOTO TAKAMICHI (JP)
UEDA KAZUSHIGE (JP)
TORII AYAME (JP)
UEDA KAZUSHIGE (JP)
TORII AYAME (JP)
Application Number:
PCT/JP2023/004183
Publication Date:
September 21, 2023
Filing Date:
February 08, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B29C55/12; B32B27/34; C08J5/18; B29K77/00; B29L7/00
Domestic Patent References:
| WO2013137395A1 | 2013-09-19 | |||
| WO2013141135A1 | 2013-09-26 |
Foreign References:
| JP2015107585A | 2015-06-11 | |||
| JP2015107586A | 2015-06-11 | |||
| JP2008044209A | 2008-02-28 | |||
| JP2021190419A | 2021-12-13 | |||
| JP2017222087A | 2017-12-21 |
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