Title:
BINDER COMPOSITION FOR HEAT-RESISTANT LAYER OF NON-AQUEOUS SECONDARY BATTERY, SLURRY COMPOSITION FOR HEAT-RESISTANT LAYER OF NON-AQUEOUS SECONDARY BATTERY, HEAT-RESISTANT LAYER FOR NON-AQUEOUS SECONDARY BATTERY, AND NON-AQUEOUS SECONDARY BATTERY
Document Type and Number:
WIPO Patent Application WO/2021/020061
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a binder composition for a heat-resistant layer of a non-aqueous secondary battery, the binder composition being capable of preparing a slurry composition which is for a heat-resistant layer of a non-aqueous secondary battery, and from which a heat-resistant layer for a non-aqueous secondary battery can be formed which is excellent not only in terms of dispersion stability and coatability but also heat shrinkage. A binder composition according to the present invention is a binder composition which is for a heat-resistant layer of a non-aqueous secondary battery and contains a water-soluble polymer and water, wherein: the water-soluble polymer contains an amide group-containing monomer unit, an acid group-containing monomer unit, and a hydroxyl group-containing monomer unit; and in the water-soluble polymer, the content of the amide group-containing monomer unit is 63-98 mass%, and the content of the acid group-containing monomer unit is 1-20 mass%.
Inventors:
ASAI KAZUKI (JP)
Application Number:
PCT/JP2020/026762
Publication Date:
February 04, 2021
Filing Date:
July 08, 2020
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F20/04; C08F20/54; C08K3/013; C08L33/26; C08L101/00; H01M4/13
Domestic Patent References:
| WO2013069697A1 | 2013-05-16 | |||
| WO2017163806A1 | 2017-09-28 | |||
| WO2017056467A1 | 2017-04-06 | |||
| WO2012115096A1 | 2012-08-30 |
Foreign References:
| JP2019057488A | 2019-04-11 | |||
| JP2017174660A | 2017-09-28 | |||
| JP2013145763A | 2013-07-25 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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