Title:
BINDER COMPOSITION FOR USE IN MOLDING PURPOSES
Document Type and Number:
WIPO Patent Application WO/2020/054363
Kind Code:
A1
Abstract:
A binder composition for use in molding purposes comprises an acid-curable resin, an acid catalyst, and an aliphatic polycarboxylic acid having 4 to 12 carbon atoms inclusive, wherein the acid catalyst comprises at least one component selected from the group consisting of a hydroxymonocarboxylic acid, a monocarboxylic acid, an aromatic carboxylic acid, sulfonic acid, ascorbic acid and an inorganic acid, and the pH value of the binder composition is 6 or lower at 25°C. According to the binder composition for use in molding purposes of the present invention, it is possible to provide a binder composition for use in molding purposes, which does not cause the pipe corrosion in a white pipe even when the binder composition contains a specific acid catalyst and is used at a pH value of 6 or lower.
Inventors:
YAMAGUCHI DAISUKE (JP)
MATSUO TOSHIKI (JP)
MATSUO TOSHIKI (JP)
Application Number:
PCT/JP2019/033050
Publication Date:
March 19, 2020
Filing Date:
August 23, 2019
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B22C1/02; B22C1/22; C08K5/092; C08L71/14
Foreign References:
| JP2000246391A | 2000-09-12 | |||
| JP2011245487A | 2011-12-08 | |||
| JP2015089553A | 2015-05-11 | |||
| US20110073269A1 | 2011-03-31 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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