Title:
BINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/031907
Kind Code:
A1
Abstract:
Provided is a binding device that, in one device, performs hole-punching of sheet bundles and binding that uses pieces. The binding device is capable of binding a sheet bundle without moving the sheet bundle, by winding a piece on from an end section of the sheet bundle. The binding device (1A) comprises: a handle (12); a platform (11a) upon which the sheet bundle (10) is placed; a tape feed unit (15) that supplies pieces (2) to a position facing the end section of the sheet bundle (10) placed upon the platform (11a); a binding unit (14) that winds a piece (2) on to the sheet bundle (10) and binds same; and a punching blade (14g) that penetrates the sheet bundle (10) and causes the free end of the piece (2) to penetrate the sheet bundle (10). The binding unit (14) is moved in accordance with the operation of the handle (12), relative to the sheet bundle (10) placed on the platform (11a).
Inventors:
TAKAHASHI HIROAKI (JP)
KUDO YASUNORI (JP)
KUDO YASUNORI (JP)
Application Number:
PCT/JP2015/074208
Publication Date:
March 03, 2016
Filing Date:
August 27, 2015
Export Citation:
Assignee:
MAX CO LTD (JP)
International Classes:
B65H37/04; B42B5/04
Foreign References:
| JPH07101178A | 1995-04-18 | |||
| JPH1024669A | 1998-01-27 | |||
| JPH10871A | 1998-01-06 | |||
| JP2009208855A | 2009-09-17 |
Attorney, Agent or Firm:
Eikoh Patent Firm, P. C. et al. (JP)
Patent business corporation glory patent firm (JP)
Patent business corporation glory patent firm (JP)
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