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Patent Searching and Data


Title:
BINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286529
Kind Code:
A1
Abstract:
A body 101 of a tape pressing module 100 is disposed with an inclination inside an attachment part 14 of an arm body 11 so as to extend under a tape pressing part 59 of a tape pressure bonding mechanism 51 (on the back side of a pressure bonding surface) from the outside to the inside of the tape pressing part 59. Thus, the tip end (arm body 11) of a second arm 5 does not protrude outside (forward when seen from the operator). Further, the inclined arrangement of the body 101 of the tape pressing module 100 makes it possible to downsize the tip end (arm body 11) of the second arm 5 and facilitates handling in a narrow place. Accordingly, the efficiency of a binding operation can be increased.

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Inventors:
SATO MASANORI (JP)
KUBOTA KAZUNARI (JP)
SUGAI JUGAKU (JP)
OKATSU TAKATO (JP)
Application Number:
PCT/JP2022/024538
Publication Date:
January 19, 2023
Filing Date:
June 20, 2022
Export Citation:
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Assignee:
NICHIBAN KK (JP)
MICROJENICS INC (JP)
International Classes:
B65B13/24
Domestic Patent References:
WO2014084205A12014-06-05
Foreign References:
JP2019142576A2019-08-29
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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