Title:
BISMALEIMIDE-BASED ADHESIVE COMPOSITION, CURED PRODUCT, ADHESIVE SHEET, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/205675
Kind Code:
A1
Abstract:
This bismaleimide-based adhesive composition contains: an inorganic filler (B); and a bismaleimide resin (A) formed by reacting an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3), wherein the content of the inorganic filler (B) is 5-55 mass% with respect to the total solid content of the adhesive composition.
Inventors:
SATO KITARU (JP)
KAMEI JUNICHI (JP)
KOMIYA SOUICHIROU (JP)
KAMEI JUNICHI (JP)
KOMIYA SOUICHIROU (JP)
Application Number:
PCT/JP2020/027886
Publication Date:
October 14, 2021
Filing Date:
July 17, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J179/08; B32B15/08; B32B27/00; C08G73/12; H05K1/03
Domestic Patent References:
| WO2018016489A1 | 2018-01-25 | |||
| WO2019188189A1 | 2019-10-03 |
Foreign References:
| JP2019082598A | 2019-05-30 | |||
| US20160237311A1 | 2016-08-18 | |||
| JP2015032639A | 2015-02-16 | |||
| JP2018538377A | 2018-12-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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