BISMALEIMIDE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, CURED PRODUCT FROM SAID PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR ELEMENT

Title:

BISMALEIMIDE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION USING SAME, CURED PRODUCT FROM SAID PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR ELEMENT

Document Type and Number:

WIPO Patent Application WO/2020/203834

Kind Code:

A1

Abstract:

Provided is a bismaleimide compound (I) that has a cyclic imide bond and is obtained by the reaction of a diamine (A) derived from a dimer acid, a tetracarboxylic dianhydride (C) having an alicyclic structure, and maleic anhydride.

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Inventors:

YAMAMOTO KAZUYOSHI (JP)
NAITOU NOBUHIKO (JP)
KAGA TAIKI (JP)
TSUBAMOTO MAI (JP)

Application Number:

PCT/JP2020/014181

Publication Date:

October 08, 2020

Filing Date:

March 27, 2020

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Assignee:

NIPPON KAYAKU KK (JP)

International Classes:

C08G73/12; G03F7/027; G03F7/031

Domestic Patent References:

WO2008153101A1

2008-12-18

Foreign References:

JP2013032501A	2013-02-14
JP2010256532A	2010-11-11
US3803103A	1974-04-09
US20130228901A1	2013-09-05
US20080262191A1	2008-10-23
JP2014001289A	2014-01-09
JP2020086387A	2020-06-04

Attorney, Agent or Firm:

SHIN-EI PATENT FIRM, P.C. (JP)

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