Title:
BLIND HOLE OPENING PROCESS OF MULTILAYER HDI CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2012/092806
Kind Code:
A1
Abstract:
Provided is a laser blind hole opening process of multilayer high density interconnection (HDI) circuit board, comprising fabricating a target hole pattern on a underlying PAD layer of a laser blind hole, laminating a resin-coated copper foil, shooting the target hole using X ray, aligning and exposing by using an automatic exposure machine, developing and opening through etching. Accurate alignment is achieved by using four target holes at the corners that are at the same plane of the underlying PAD layer of the laser blind hole and the target hole is shoot by using an accurate X-ray shooting machine, so that the repeated use of external guide hole and errors in mechanical drilling are avoided, and accurate opening of laser blind hole is achieved. The process is simple and has high efficiency.
Inventors:
ZHOU GANG (CN)
ZHAO ZHIPING (CN)
ZHAO ZHIPING (CN)
Application Number:
PCT/CN2011/083792
Publication Date:
July 12, 2012
Filing Date:
December 09, 2011
Export Citation:
Assignee:
HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY CO LTD (CN)
ZHOU GANG (CN)
ZHAO ZHIPING (CN)
ZHOU GANG (CN)
ZHAO ZHIPING (CN)
International Classes:
H05K3/40; H05K3/00; H05K3/46
Foreign References:
| CN101257769A | 2008-09-03 | |||
| CN101543144A | 2009-09-23 | |||
| CN1199765C | 2005-05-04 | |||
| CN201405099Y | 2010-02-17 | |||
| CN2419789Y | 2001-02-14 | |||
| CN102036508A | 2011-04-27 |
Attorney, Agent or Firm:
YOGO PATENT & TRADE MARK AGENT CO., LTD. (CN)
广州粤高专利商标代理有限公司 (CN)
广州粤高专利商标代理有限公司 (CN)
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Claims: