Title:
BLISTER PACKAGE, METHOD FOR MANUFACTURING BLISTER PACKAGE, AND RF DEVICE USING BLISTER PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/157329
Kind Code:
A1
Abstract:
The present invention provides a blister package (10) provided with: a sheet (11) in which a pocket (12) is molded; and a lid material (13) sealing the sheet (11), wherein the sheet (11) has a first pocket (12A) in which an RF tag (14) is accommodated and a second pocket (12B) in which an article (15) is accommodated at a position different from a position of the first pocket (12A).
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Inventors:
KUBOTA YOU (JP)
MIYAZAKI RENA (JP)
NITTA SHINYA (JP)
MIYAZAKI RENA (JP)
NITTA SHINYA (JP)
Application Number:
PCT/JP2021/001459
Publication Date:
August 12, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
SATO HOLDINGS KK (JP)
SATO HOLDINGS KK (JP)
International Classes:
B65D25/20; A61J1/03; B65D75/36; G06K19/07; G06K19/077
Domestic Patent References:
| WO2017057458A1 | 2017-04-06 |
Foreign References:
| JP2005112378A | 2005-04-28 | |||
| JP2008247418A | 2008-10-16 | |||
| JP2010035789A | 2010-02-18 | |||
| JP2020018855A | 2020-02-06 | |||
| JP2003233673A | 2003-08-22 | |||
| JP2005211601A | 2005-08-11 |
Other References:
See also references of EP 4101780A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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