Title:
BLOCK COPOLYMER, RESIN COMPOSITION, CURED PRODUCT, RESIN FILM, PREPREG, MULTILAYER BODY AND MATERIAL FOR ELECTRONIC CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO/2023/167152
Kind Code:
A1
Abstract:
The present invention provides a block copolymer which comprises a polymer block (B) that is mainly composed of a conjugated diene monomer unit, and a polymer block (A) that is mainly composed of a vinyl aromatic monomer unit and/or a polymer block (C) that is composed of a vinyl aromatic monomer unit and a conjugated diene monomer unit, and which satisfies the conditions (i) to (iii) described below. Condition (i): The weight average molecular weight of the block copolymer is 35,000 or less. Condition (ii): The content of the vinyl aromatic monomer unit in the block copolymer is 30% by mass or more. Condition (iii): Relative to 100 parts by mass of the block copolymer, 5 parts by mass or more of the polymer block (B) is positioned at ends of the block copolymer.
Inventors:
MATSUOKA YUTA (JP)
HATTORI GOKI (JP)
SUKEGAWA TAKASHI (JP)
KONDO TOMOHIRO (JP)
ARAKI YOSHIFUMI (JP)
HATTORI GOKI (JP)
SUKEGAWA TAKASHI (JP)
KONDO TOMOHIRO (JP)
ARAKI YOSHIFUMI (JP)
Application Number:
PCT/JP2023/007145
Publication Date:
September 07, 2023
Filing Date:
February 27, 2023
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08F297/04; B32B15/082; B32B27/00; B32B27/30; C08J5/24; C08L27/12; C08L53/02; C08L63/00; C08L67/03; C08L71/12; C08L79/08; C08L101/00
Foreign References:
| JPH05345813A | 1993-12-27 | |||
| JP2001261757A | 2001-09-26 | |||
| JPH05245927A | 1993-09-24 | |||
| JPH05245928A | 1993-09-24 | |||
| JPH11236425A | 1999-08-31 | |||
| JP2002060447A | 2002-02-26 | |||
| JP2002060448A | 2002-02-26 | |||
| JP2001158805A | 2001-06-12 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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