Title:
BLOCK-LIKE SILVER POWDER AND MANUFACTURING METHOD THEREOF, AND ELECTRICALLY CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2023/176402
Kind Code:
A1
Abstract:
Provided is a block-like silver powder having a BET specific surface area of 0.5 m2/g or less, an average aspect ratio when 100 or more silver particle cross sections are observed of 1.2 or greater and less than 2.0, and an average ratio of a peripheral length of a silver particle to a peripheral length of a circumscribing rectangular shape expressed by (Formula 1) of 0.84 or greater. (Formula 1): L/(2 x major diameter + 2 x minor diameter), where L is the peripheral length of the silver particle, and major diameter and minor diameter are the major diameter (μm) and the minor diameter (μm) of a rectangular shape having the smallest area of rectangular shapes circumscribing a contour of a silver particle cross section.
Inventors:
NAKAYAMA SEIJI (JP)
KIMURA YUKI (JP)
KIMURA YUKI (JP)
Application Number:
PCT/JP2023/007073
Publication Date:
September 21, 2023
Filing Date:
February 27, 2023
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F1/06; B22F9/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Foreign References:
| JP2007265801A | 2007-10-11 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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