Title:
BMS GROUND ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/080589
Kind Code:
A1
Abstract:
The present invention relates to a BMS assembly comprising: a circuit board which has a first fastening hole for grounding; a first casing mold which accommodates the circuit board and includes a bushing portion formed inside a second fastening hole that is indented from the outside; and a fastening unit which penetrates the first fastening hole and the second fastening hole, presses an upper surface of the bushing portion, and contacts the circuit board with the bushing portion, wherein the bushing portion includes: a vertical portion formed in a direction parallel to the second fastening hole; and a horizontal portion extending from an end of the vertical portion in a direction perpendicular to a direction in which the vertical portion is formed, and the fastening unit grounds the circuit board by being electrically connected to a case accommodating a plurality of batteries therein.
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Inventors:
YOON SANG HYUN (KR)
Application Number:
PCT/KR2023/013844
Publication Date:
April 18, 2024
Filing Date:
September 14, 2023
Export Citation:
Assignee:
LG ENERGY SOLUTION LTD (KR)
International Classes:
H05K7/14; H01M50/284; H05K9/00
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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