Title:
BOARD CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2023/223811
Kind Code:
A1
Abstract:
In the present invention, the area occupied by a peg on a circuit board is reduced. A board connector (A) is provided with: a housing (10); and a metal peg (20) that is attached to an outer wall surface (12) of the housing (10) and is fixed to a circuit board (P) by solder (S). The peg (20) has a narrow space (33) that opens in a slit shape toward the circuit board (P) and allows the molten solder (S) on the circuit board (P) to enter by capillary action. On an surface (41) of the peg (20) that faces the circuit board (P) and an inner surface of the narrow space (33), an alloy layer comprising the solder (S) and the peg (20) is formed, and this alloy layer contributes to improving the fixing strength of the peg (20) with respect to the circuit board (P). The alloy layer in the narrow space (33) extends away from the circuit board (P); therefore, the surface (41) of the peg (20) that faces the circuit board (P) can be kept small in area.
Inventors:
CHEN YICHENG (JP)
Application Number:
PCT/JP2023/016838
Publication Date:
November 23, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/51
Foreign References:
| JP2012033436A | 2012-02-16 | |||
| JP2000113926A | 2000-04-21 | |||
| JP2015041510A | 2015-03-02 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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