BOARD CONSISTING OF REINFORCED PAPER, AND PALLET USING SAME

Title:

BOARD CONSISTING OF REINFORCED PAPER, AND PALLET USING SAME

Document Type and Number:

WIPO Patent Application WO/2016/139961

Kind Code:

A1

Abstract:

The present invention addresses the problem of increasing the bending strength of a board consisting of paper, the increased bending strength being obtained without largely increasing the thickness of the board. The present invention provides a board consisting of paper, the board comprising a board-shaped structure and a paperboard layer which is adhered to the board-shaped structure. The board-shaped structure includes a core, a first paper liner layer, and a second paper liner layer, the first and second paper liner layers being adhered to the core so that the core is sandwiched and held between the first and second paper liner layers. The paperboard layer is adhered to the first paper liner layer, the thickness of the board-shaped structure is in the range of approximately 15 mm to approximately 40 mm, the thickness of each of the first paper liner layer and the second paper liner layer is in the range of approximately 0.5 mm to approximately 1.2 mm, and the thickness of the paperboard layer is in the range of approximately 1mm to approximately 4 mm.

Inventors:

YOSHII HISAYOSHI (JP)

Application Number:

PCT/JP2016/001215

Publication Date:

September 09, 2016

Filing Date:

March 04, 2016

Export Citation:

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Assignee:

YOSHII HISAFUMI (JP)
ECOBOARD CO LTD (JP)

International Classes:

B32B29/08; B32B3/12; B32B3/28; B65D19/34; D21H27/30

Foreign References:

JP2009046140A	2009-03-05
JPH11342551A	1999-12-14
JPH10337687A	1998-12-22
JPS61172026U	1986-10-25
JP2002370739A	2002-12-24
JPH01154129U	1989-10-24
JPH07206051A	1995-08-08
JPS60182132U	1985-12-03
JPH07223640A	1995-08-22
JPH0310832A	1991-01-18

Other References: