Title:
BOARD FOR ELECTRONIC PARTS, METHOD FOR MANUFACTURING BOARD FOR ELECTRONIC PARTS, AND DISPLAY DEVICE AND SEMICONDUCTOR DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2024/085727
Kind Code:
A1
Abstract:
The present invention relates to a board for electronic parts, a method for manufacturing the board for electronic parts, and a display and a semiconductor device which include the board, the board comprising: a substrate including at least one through via; and a tight-adhesion enhancement layer on the surface of the substrate and in the through via, wherein the through via has, at at least one of the upper and lower surfaces, a hole diameter that is greater than the hole diameter at a site inside the hole. Due to the inclusion of the tight-adhesion enhancement layer, the tight adhesion of a metal plating layer is improved, thus preventing the occurrence of defects and also simplifying manufacturing processes as compared to conventional boards for electronic parts.
Inventors:
KIM DUCK-KYEOM (KR)
KIM BEOM-CHEOL (KR)
CHOI JEONG-MIN (KR)
KIM BEOM-CHEOL (KR)
CHOI JEONG-MIN (KR)
Application Number:
PCT/KR2023/016403
Publication Date:
April 25, 2024
Filing Date:
October 20, 2023
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
H05K1/11; H05K1/03; H05K3/18; H05K3/42
Foreign References:
| KR20220033829A | 2022-03-17 | |||
| JP2020521332A | 2020-07-16 | |||
| KR101950665B1 | 2019-02-20 | |||
| JP2022147360A | 2022-10-06 | |||
| KR102186147B1 | 2020-12-03 |
Attorney, Agent or Firm:
HANYANG PATENT FIRM (KR)
Download PDF: