Title:
BOARD INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/188701
Kind Code:
A1
Abstract:
An inspection method that reduces the number of times an inspection is performed on multi-terminal wiring patterns is provided. A board inspection method is a method for inspecting wiring patterns of a sheet board that includes a plurality of unit boards, each having a plurality of multi-terminal wiring patterns, by connecting wiring patterns of at least two of the unit boards to a board inspection apparatus for performing electrical inspection, to determine quality of the wiring patterns. The method includes selecting one wiring pattern that is formed on one unit board and is targeted for inspection and another wiring pattern that is formed on another unit board in the same manner as the one wiring pattern, electrically connecting an arbitrary terminal of the one wiring pattern and an arbitrary terminal of the other wiring pattern to establish a short circuit between the one wiring pattern and the other wiring pattern, and performing an inspection for continuity between a terminal other than the arbitrary terminal of the one wiring pattern and a terminal other than the arbitrary terminal of the other wiring pattern.
Inventors:
YAMASHITA MUNEHIRO (JP)
Application Number:
PCT/JP2014/002631
Publication Date:
November 27, 2014
Filing Date:
May 19, 2014
Export Citation:
Assignee:
NIDEC READ CORP (JP)
International Classes:
G01R31/02; H05K3/00
Foreign References:
| JP2009080061A | 2009-04-16 | |||
| JPH04102079A | 1992-04-03 | |||
| JP2008281406A | 2008-11-20 |
Attorney, Agent or Firm:
KITAMURA, Hideaki (338 Kuzetonoshiro-cho, Minami-ku, Kyoto-sh, Kyoto 05, JP)
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