BOARD-LEVEL HEAT DISSIPATION SIMULATION METHOD, SYSTEM AND MEDIUM

WIPO Patent Application WO/2024/082569

A1

The present invention belongs to the field of model simulation. Disclosed are a board-level heat dissipation simulation method, a system and a medium. In view of the problems of the long consumed time and the high cost of existing PCB heat dissipation simulation, the present invention provides a board-level heat dissipation simulation method, comprising the following steps: importing a simulation model; creating a heat dissipation simulation procedure; performing simulation analysis; if a simulation result shows the absence of a heat dissipation risk, determining the simulation result is qualified; if the simulation result shows the presence of the heat dissipation risk, keeping the simulation result and the simulation procedure corresponding to the simulation result, and modifying a model layout on the basis of the original simulation model; and, according to the modified model layout, repeating the steps S2-S4 until the simulation result is qualified. Without an actual product produced, the present invention performs simulation analysis on the imported simulation model, thus greatly reducing the research and development time and the proofing cost; in addition, the present invention can modify the original model layout according to the current result, thus reducing a significant amount of repetitive work and increasing the research and development speed. The present invention has a simple system structure and works stably.

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DAI WENLIANG (CN)
LING FENG (CN)
LIU PENG (CN)
JIANG LIGUO (CN)
ZHONG ZHANGMIN (CN)

PCT/CN2023/086539

April 25, 2024

April 06, 2023

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XPEEDIC CO LTD (CN)

G06F30/398; G06F30/15

CN114239442A	2022-03-25
CN109255192A	2019-01-22
CN111666627A	2020-09-15
EP2110762A1	2009-10-21
CN115544957A	2022-12-30

SHANGHAI LEHONG PATENT AGENCY (GENERAL PARTNERSHIP) (CN)

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