Title:
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/143707
Kind Code:
A1
Abstract:
Provided are a board-level structure and a communication device. The board-level structure comprises an upper-layer substrate and a lower-layer substrate and a plurality of support members capable of being supported therebetween. There is a gap between the upper-layer substrate and the lower-layer substrate, and the gap comprises at least one first gap area and at least one second gap area. The first gap area is spaced apart from the second gap area, and a spacing area therebetween does not comprise the first gap area or the second gap area. The maximum vertical distance between the upper-layer substrate and the lower-layer substrate in the first gap area is less than the minimum vertical distance between the upper-layer substrate and the lower-layer substrate in the second gap region, and the difference between the maximum vertical distance and the minimum vertical distance is greater than or equal to 100 μm. The plurality of support members are distributed at intervals between the first gap area and/or the second gap area. The technical solution of the present application can satisfy the board-level assembly requirements and welding quality of a package substrate and a printed circuit board under large amounts of deformation.
Inventors:
LIANG YING (CN)
Application Number:
PCT/CN2021/142256
Publication Date:
July 07, 2022
Filing Date:
December 29, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/13; H01L23/488
Foreign References:
| CN101752279A | 2010-06-23 | |||
| CN101297233A | 2008-10-29 | |||
| TW200903120A | 2009-01-16 | |||
| TW460725B | 2001-10-21 | |||
| CN202011639632A | 2020-12-31 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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