Title:
BOARD MATERIAL PROCESSING COMPOSITION, BOARD MATERIAL LAMINATE, AND METHOD FOR MANUFACTURING BOARD MATERIAL LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/224782
Kind Code:
A1
Abstract:
Provided is a board material processing composition enabling manufacture of a board material laminate which is non-combustible and superior in adhesive performance. In order to solve this problem, a board material processing composition that inhibits combustion of a board material due to heating contains: an inorganic carbonization promotion component that promotes carbonization of an organic component in the board material during the heating; an inorganic chain inhibition component that inhibits a reaction chain to adjacent components due to a product of endothermic decomposition generated during the heating; and inorganic hydrophobic binder particles that adhere the organic component in the board material with the carbonization promotion component and the chain inhibition component.
Inventors:
HATTORI TOSHINORI (JP)
Application Number:
PCT/JP2022/016238
Publication Date:
October 27, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
M&H TECHNICAL RES INSTITUTE CO LTD (JP)
International Classes:
B27D1/04; B27K3/20; B27K3/32; C09K21/02; C09K21/04
Foreign References:
| JPH04161688A | 1992-06-05 | |||
| JP2006182024A | 2006-07-13 | |||
| JPH0699407A | 1994-04-12 | |||
| JPS51127596A | 1976-11-06 | |||
| JPH02116505A | 1990-05-01 | |||
| US4168175A | 1979-09-18 | |||
| JP2012081603A | 2012-04-26 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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