Title:
BOILING COOLING DEVICE AND ELECTRONIC DEVICE HAVING SAME MOUNTED THEREON
Document Type and Number:
WIPO Patent Application WO/2017/208461
Kind Code:
A1
Abstract:
A boiling cooling device (30) has: a plurality of heat receiving members (32a, 32b) that are disposed corresponding to a plurality of heat generating bodies (20a, 20b), respectively; a condensing section (31), which condenses and liquefies the vapor of a refrigerant (R) that has been heated and boiled by means of the heat receiving members; and a plurality of connecting pipes (36a, 36b) for transporting the refrigerant. The connecting pipes are: an upstream connecting pipe (36a) that connects to each other the condensing section and the heat receiving member closest to the condensing section; and another pipe, i.e., a downstream connecting pipe (36b) that connects to each other the heat receiving members that are disposed in the downstream of the upstream connecting pipe. The upstream connecting pipe (36a) and the downstream connecting pipe (36b) have single pipe structures, respectively.
Inventors:
KONDOU YOSHIHIRO (JP)
NISHIHARA ATSUO (JP)
NISHIHARA ATSUO (JP)
Application Number:
PCT/JP2016/066672
Publication Date:
December 07, 2017
Filing Date:
June 03, 2016
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
F28D15/02; H01L23/427; H05K7/20
Domestic Patent References:
| WO2015056288A1 | 2015-04-23 | |||
| WO2006134659A1 | 2006-12-21 |
Foreign References:
| US20140014303A1 | 2014-01-16 | |||
| JPH07321263A | 1995-12-08 | |||
| JP2010033103A | 2010-02-12 | |||
| JPH1167997A | 1999-03-09 | |||
| JP2011002211A | 2011-01-06 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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